The LFPAK33 brings NXP’s robust and reliable copper clip technology to the Power33 (3.3 mm x 3.3 mm) footprint
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LFPAK33 Shrinking the Power Footprint - Factsheet
The LFPAK33 brings NXP’s robust and reliable copper clip technology to the Power33 (3.3 mm x 3.3 mm) footprint